- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/367 - Cooling facilitated by shape of device
Patent holdings for IPC class H01L 23/367
Total number of patents in this class: 5415
10-year publication summary
|
381
|
477
|
507
|
605
|
665
|
663
|
652
|
593
|
574
|
241
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
451 |
| Intel Corporation | 45621 |
335 |
| Samsung Electronics Co., Ltd. | 131630 |
241 |
| International Business Machines Corporation | 60644 |
178 |
| Mitsubishi Electric Corporation | 43934 |
173 |
| Micron Technology, Inc. | 24960 |
112 |
| Infineon Technologies AG | 8189 |
101 |
| Huawei Technologies Co., Ltd. | 100781 |
88 |
| Denso Corporation | 23338 |
86 |
| Fuji Electric Co., Ltd. | 4750 |
84 |
| Qualcomm Incorporated | 76576 |
68 |
| Semiconductor Components Industries, L.L.C. | 5345 |
59 |
| Monolithic 3D Inc. | 270 |
59 |
| NXP USA, Inc. | 4155 |
59 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
55 |
| Siemens AG | 24990 |
50 |
| Texas Instruments Incorporated | 19376 |
47 |
| Murata Manufacturing Co., Ltd. | 22355 |
47 |
| Rohm Co., Ltd. | 5843 |
47 |
| Qorvo US, Inc. | 2018 |
46 |
| Other owners | 3029 |